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PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
? AN1955: Thermal Measurement Methodology of RF Power Amplifiers
? AN3100: General Purpose Amplifier and MMIC Biasing
Software
? .s2p File
Development Tools
? Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
3
4
5
6
Date
Mar. 2007
July 2007
Mar. 2008
Feb. 2012
Description
? Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, p. 6, 7
? Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
? Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
? Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
? Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, p. 8, 9
? Corrected temperature at which ThetaJC is measured from 25 ° C to 86 ° C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
? Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
? Removed I CC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
as bias is not a controlled value, p. 4--9
? Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14
MMG3007NT1
14
RF Device Data
Freescale Semiconductor, Inc.
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相关代理商/技术参数
MMG3007NT1_08 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Heterojunction Bipolar Transistor (InGaP HBT)
MMG3007NT1_12 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Heterojunction Bipolar Transistor
MMG3008NT1 功能描述:射频放大器 12DBM 20DBGAIN GPA SOT89 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
MMG3008NT1_08 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Heterojunction Bipolar Transistor (InGaP HBT)
MMG3008NT1_12 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Heterojunction Bipolar Transistor
MMG3009NT1 功能描述:射频放大器 18DBM 15DBGAIN GPA SOT89 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
MMG3009NT1_08 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Heterojunction Bipolar Transistor (InGaP HBT)
MMG3010NT1 功能描述:射频放大器 15DBM 15DB GAIN GPA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel